specificatio n part no . : L07R3000F1 3.0mm round le d l am p checked b y a pproved b y prepared by r.s. j.w-j. a.w.
3.0mm round led lam p part no. : L07R3000F1 d e s cri pt i o n this lamp is made with algaas/gaas super red chip and red diffused epoxy resin . p art n o . L07R3000F1 le d chi p materia l lens colo r emitting colo r a l g a as / g a a s super re d fir s t e d itio n d ate : 2005/04/2 4 1.all dimensions are in millimeters. 2. t o le r a n ce i s 0.25mm unless otherwise noted . red diffu s e d page : 1/ 7 notes: p a c kag e d i m e ns i on s a k 0.5ma x
abso l ut e m ax i mum rat i ngs at ta = 2 5 electrical and optical characteristics : page : 2/ 7 paramete r reverse voltage d.c. forward current peak current (1/10 duty cycle , 0.1 ms pulse width ) operating temperature range storage temperature range lead soldering temp.(1.6mm from body) for 5 second s tst g top r if(peak ) i f v r symbo l rat i n g 4 3 0 10 0 -2 5 to + 8 5 26 0 m a m a v uni t -4 0 to +10 0 paramete r symbo l c o nd itio n mi n . ty p . max . uni t luminous intensit y for w ar d v oltag e peak wavelengt h r ever s e(lea k age) cu rre n t spectrum line halfwidt h i v v f i r if=20m a if=20m a if=20m a vr=4 v if=20m a 4 5 mc d 1. 8 v n m 2 0 n m 10 0 a p d 2 0 2. 2 po w er d issipatio n p d 6 6 m w dominant wavelengt h viewing angle 2 1/ 2 if=20m a 7 4 de g if=20m a n m 66 0 64 3 reverse (leakage) current i r 10 0 a 3.0mm round led lam p part no. : lt0371-2 1 fir s t e d itio n d ate : 2005/04/2 4
a pplied v oltage ( v ) forward current vs.applied voltage 20. 0 forward current (ma) relative luminou s inten s ity 10. 0 0 1 5 3 0 6 0 4 5 7 5 30. 0 a mbient temperature ta ( c ) ambient temperature vs. forward curren t 0 2 0 4 0 6 0 10 0 8 0 forward current if(ma ) 1 0 2 0 4 0 3 0 5 0 forward current if(ma ) 1 0 2 0 4 0 3 0 5 0 typical electrical / optical characteristics curves : page : 3/ 7 1. 2 1. 6 2. 0 2. 4 2. 8 3. 2 0. 0 forward current vs. luminous intensity 3.0mm round led lam p part no. :L07R3000F1 fir s t e d itio n d ate : 2005/04/2 4 radia t i o n dia g ra m 1. 0 0. 7 0. 8 0. 9 0. 1 0. 5 0. 3 0. 2 0. 4 0. 6 90 70 80 50 60 20 0 10 30 40
page : 4/ 7 reliability test failure judgment criteri a ite m foward voltag e c ri t eri a fo r judgm e n t m ore than 12 0 % x upp e r limit of sp ec . reverse (leakage) curren t m ore than 10 0 % x upp e r limit of sp ec . luminous intensit y mor e t h a n 5 0 % x l ow e r limit of sp ec . solderbilit y less than 9 5 % r elia b ility te s t discriptio n no . test metho d t e st cond i t i o n opera ti ona l li fe 1 1000 hr s if=20ma, ta=2 5 high temp. storag e 2 1000 hr s 10 0 low temp. storage 3 1000 hr s -4 0 high temp./high humidit y 4 1000 hr s 6 0 temperature cycling 5 100 cycle s -3 0 (30 mi n ) +2 5 (5min ) +8 0 (30 mi n ) +2 5 (5min ) soldering hea t 7 5 s ec . 260 5 c 1.6mm from bottom of cas e dro p 9 x.y.z direction each 1 tim e m a p le p late , 75 c m lead pul l 1 0 10 sec . weight 0.5k g lead ben d 1 1 2 times wei gh t 0.25kg,b e nd i ng ang le =9 0 6 damp heat cyclic 40 cy cle s time of 1 cucle: 6 hr s i f =20m a , ta=2 5 c - 0 2(2h) 6 5 2 90-9 5 %rh(3h ) - (1h ) the result of the above reliability test will be referred to the electrical and o pt ic a l cha r a c t eri st ic i n th i s sp eci f ic at i on and judgm e nt w ill b e mad e i n accordance with the following criteria listed below. solderabilit y 8 5 0.2 s ec . wave soldering . 260 5 c speed of immersing and lifting 2 5 2.5mm/sec 3.0mm round led lam p part no. : L07R3000F1 fir s t e d itio n d ate : 2005/04/2 4
page : 5/ 7 precautions : take note of the following in use of led 1. temperature in us e s i n ce t h e li gh t g e n e r ate d i ns i d e t h e le d n ee ds t o b e emitte d t o ou t s i d e e ff icie n tl y, a r e s i n w it h high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors ca nno t b e a dd e d t o t h e r e s i n . consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-13 0 c . at a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened . if external force or s tre ss i s applied at that time, it may cau s e a w ire rupture . 2. so l d e r i n g please be careful on the following at soldering . after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) so l d e r i ng mea sur eme n t s : d i s tance bet w een melted s older s ide to bottom of re s in s hall be 1.6mm or longer. (2) solder dip: preheat: 9 0 c max. (back s ide of p cb), within 120 s econd s solder bath: 25 0 c max. (solder temperature), within 5 seconds (3) soldering iron : 25 0 c ma x. ( tem p e r at ur e of so l d e r i ng i ron ti p), wit h i n 3 s ec ond s 3. insertio n pitch of the led leads and pitch of mounting holes need to be sam e 4. other s since the heat resistant ability of the led resin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the led and follow the conditions below. baking temperature: 120 c max. baking time: within 60 s econds if so l d e r i ng i s don e s e qu e n tiall y a f te r t h e a dh e s i v e b a k i ng, p lea s e p e rfor m t h e so l d e r i ng a f te r cooling down the led to normal temperature. 3.0mm round led lam p part no. : L07R3000F1 fir s t e d itio n d ate : 2005/04/2 4
page : 7/ 7 3.0mm round led lam p part no. : L07R3000F1 fir s t e d itio n d ate : 2005/04/2 4
c ompon e n t and ma teri a l s : ite m material s customer part no. o.m.c. part no . l07r3000r1 led chip algaas on gaas leadfram e iron covered with silve r s il v er f ille d e pox y re s i n epox y ha r d e nn e r epox y diffusan t coloring dye bonding wire gol d adhesiv e e pox y re s i n epox y p ag e : 6 / 7 epox y 3.0mm round led lam p part no. : L07R3000F1 fir s t e d itio n d ate : 2005/04/2 4
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